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광범위한 단쇄 분지 분포를 갖는 폴리에틸렌 공중합체 / 더블유.알. 그레이스 앤드 캄파니-콘. 다음 특징을 갖는 에틸렌 단위 및 C4 내지 C8 α-올레핀 공단량체 단위를 포함하는 폴리에틸렌 공중합체: 2.16 kg 및 190℃ 하에서 ASTM D1238에 의해 190℃에서 결정된 약 0.1 내지 약 15 g/10분의 용융 지수; 0.905 내지 0.930 g/cc의 밀도; 약 1.5 내지 약 2.7의 분자량 분포; 식: ΔT[℃] ≥ -909*밀도[g/cc] + 863을 따르는 온도 눈금 상에서의 처음 10% 및 마지막 1% 중합체를 제외한 결정화 용출 분획화 온도 범위; 및 식: F% ≥ 510 *(밀도[g/cc] -0.905)을 따르는 라멜라 두께 분포 - 여기서, F%는 12 nm 초과의 라멜라 두께의 백분율임 -. |
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ETHYLENE/ALPHA-OLEFIN INTERPOLYMER COMPOSITIONS FOR EXTRUSION APPLICATIONS / SUN, Yabin Compositions and related processes comprising the following components a) and b) : a) a first composition comprising a multimodal ethylene/alpha-olefin interpolymer, and wherein the first composition comprises the following properties: i) a density from 0.855 to 0.900 g/cc, ii) a [V100 (190℃) ] ≤ 1000 Pa·s, iii) a [V0.1 (190℃) /V100 (190℃) ] ≥ 8.0, b) at least one peroxide. Compositions and related processes comprising the following components a) through c): a) an first composition comprising a multimodal ethylene/alpha-olefin interpolymer, and wherein the first composition comprises the following properties: i) a density from 0.855 to 0.900 g/cc, ii) a [V0.1 (190℃) /V100 (190℃) ] ≥ 5.0, b) at least one peroxide, c) at least one Tempo compound of Structure I) selected from Structure IA, Structure IB or Structure IC, each as described herein. |
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LIQUID STATE DETECTION SENSOR / NGK SPARK PLUG CO LTD PROBLEM TO BE SOLVED: To provide a liquid state detection sensor capable of satisfactorily accurately acquiring digital values used for detecting the state of liquids even through the use of a low-resolution A/D converter. SOLUTION: The liquid state detection sensor 100 includes an element 151; a main energization means CC1 for performing main energization; digital value acquisition means 190 and CC2, CC3, CC4 for acquiring digital element voltage values Vd1b and Vd1c by main energization; and a means S16 for detecting the concentration NC of a liquid. When a constant-multiple element voltage Va1b is made of a fundamental voltage part Va4a and a detection voltage part Va6b, the digital value acquisition means sets the fundamental voltage part at a fundamental-voltage-part setting means CC3 to provide the detection voltage part with magnitude convertible from analog to digital form at a detection voltage A/D conversion means 190. |
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Polyethylene resin composition and film thereof / Mitsui Petrochemical Industries, Ltd. (Tokyo JPX 03) A polyethylene resin composition comprised of (A) 30 to 50% by weight of a linear low density polyethylene resin wherein (i) the MFR190°C. is 0.3 to 3.0/10 min, (ii) the density is 0.900 to 0.918 g/cc, (iii) the MI20/MI2 is 40 or less, (iv) there are one or more endothermic peaks of the melting point determined by a differential scanning calorimeter, wherein, when there are two or more peaks, the highest melting point (Tm1) is 118°to 125°C. and the ratio Tm1H/Tm2H between the endothermic peak height (Tm1H) of the highest melting point and the next low temperature side endothermic peak height (Tm2H) of 1.2 or less, and (v) the comonomer is an a190°C. is 0.01 to 0.2 g/10 min, (ii) the density is 0.935 to 0.950 g/cc, and (iii) the MI20/MI2 is 80 or more, (C) 10 to 40% by weight of a high pressure low density polyethylene resin wherein (i) the MFR190°C. is 0.1 to 2.0 g/10 min, (ii) the density is 0.915 to 0.924 g/cc, and (iii) the melt tension is 5 g or more, wherein the polyethylene resin composition is characterized in that (i) the MFR190°C. is 0.2 to 1.0 g/10 min, (ii) the density is 0.918 to 0.935 g/cc, and (iii) the melt tension is 5 g or more. |
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단일축으로-배향된 중합체 필름, 및 이들로부터 제조된 물품 / 다우 글로벌 테크놀로지스 엘엘씨 하기의 각 특성을 나타내는 선형 저밀도 폴리에틸렌을, 적어도 하나의 층에 존재하는 물질의 총량을 기준으로, 적어도 65 wt.%를 포함하는 적어도 하나의 층을 갖는 단일축으로-배향된 에틸렌계 중합체 필름: 적어도 60%의 CDBI; ASTM D 1238(2.16 kg @190℃)에 따라 측정된 1.8 g/10분 내지 10 g/10분의 용융 지수, I2; 0.910 g/cc 내지 0.940 g/cc의 밀도; 및 3.0 미만의 Mw/Mn. |
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접착제 조성물 / 다우 글로벌 테크놀로지스 엘엘씨 조성물은 (A) 0.855 g/cc 내지 0.895 g/cc의 밀도 및 177℃에서 5,000 mPa·s 내지 50,000 mPa·s의 용융 점도를 갖는 에틸렌/α-올레핀 공중합체; (B) 190℃에서 10,000 mPa·s 초과 내지 50,000 mPa·s의 용융 점도 및 30,000 g/몰 초과의 중량 평균 분자량 Mw를 갖는, 1 wt% 내지 10 wt% 기능기를 함유하는 기능화된 프로필렌-계 중합체; (C) 점착부여제; 및 (D) 왁스를 함유한다. |
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POLYMER BLENDS / Chai, Choon Kooi Novel polymer blends comprise (a) 90-97% by weight of a copolymer of ethylene and an alpha olefin having from 3 to 10 carbon atoms, said copolymer having (i) a density in the range of 0.910 to 0.940 g cm−3, (ii) a melt index (190° C./2.16 kg), MI25, and (iii) molecular weight distribution Mw-cc/Mn-cc, by classical GPC) in the range 2.0-5.0, and (b) from 3-10% by weight of a low density polyethylene polymer having (i) a density from 0.910 to 0.920 g cm″3, (ii) a melt index (190° C./2.16 kg), MI22, and (iii) a melt elastic modulus G′ (G″=500 Pa)140 Pa at 190° C., wherein the sum of (a) and (b) is 100%. The copolymer component (a) may be prepared by use of metallocene catalyst systems and the novel blends exhibit an improved balance of processability and mechanical properties and are particularly useful for film applications. |
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POLYETHYLENE COPOLYMER WITH BROAD SHORT CHAIN BRANCHING DISTRIBUTION / CO.-CONN. A polyethylene copolymer comprising ethylene units and C4 to C8 α-olefin comonomer units having the following characteristics: a melt index from about 0.1 to about 15 g/10 min as determined at 190°C by ASTM D1238 under 2.16 kg and at 190°C; a density from 0.905 to 0.930 g/cc; a molecular weight distribution from about 1.5 to about 2.7; a Crystallization Elution Fractionation temperature range excluding the first 10% and the last 1% polymer on the temperature scale following the equation: ΔΤ [°C] ≥ -909* (density [g/cc]) + 863; and a lamellar thickness distribution following the equation: F %≥ 510 * (density [g/cc] -0.905), where F % is the percentage of lamellar thickness greater than 12 nm. |
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ELECTRONIC APPARATUS, CONTROL METHOD OF ELECTRONIC APPARATUS, AND PROGRAM / CANON INC PROBLEM TO BE SOLVED: To provide an electronic apparatus or the like that can communicate in accordance with a plurality of standards via a single connector, and can effectively prevent failure of a device without impairing the freedom of design.SOLUTION: In an initial state, a system control unit 170 controls a selector 190 not to select any of a USB data communication unit 150b and an HDMI data communication unit 160b. If a CC detection unit 150a detects a CC signal, the system control unit controls the selector 190 to select the USB data communication unit 150b, and if an HPD detection unit 160a detects an HPD signal, the system control unit controls the selector 190 to select the HDMI data communication unit 160b.SELECTED DRAWING: Figure 3 |
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POLYPHENYLENE RESIN COMPOSITION AND FILM / MITSUI PETROCHEM IND LTD (PURPOSE) To obtain a PE resin composition having a good balance among strength, rigidity and gloss, excelling in moldability, an ability to seal foreign matter and low-temperature properties and suited for a film for heavy-duty packaging bags by mixing a linear low-density PE resin with a high-density PE resin and a high-pressure process low-density PE resin. (CONSTITUTION) This PE resin composition comprises 30-50wt.% linear low- density PE resin containing a 4 C or higher olefin as a comonomer and having an MFR190 °C of 0.3-3.0g/10min, a density of 0.990-0.918g/cc, an MI20 /MI2 ratio ≤20, 20-40wt.% high-density PE resin of an MFR190 ° of 0.01-0.2g/10min, a density of 0.935-0.950g/cc and an MI20 /MI2 ratio ≥80, and 10-40wt.% high-pressure process low-density PE resin of an MFR190 °C of 0.1-2.0g/10min, a density of 0.915-0.942g/cc and a melt tension ≥5g and having an MFR190 °C of 0.2-1.0g/10min, a density of 0.918-0.35g/cc and a melt tension ≥5g. This resin composition has a good balance among strength, rigidity and gloss, excelling in moldability, an ability to seal foreign matter and low-temperature properties and suited for a film for heavy-duty packaging bags for organic feeds or the like. |
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더보기ScienceON '보고서' 검색
더보기No | 제목 / 내용 |
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한국 자연폐경여성에서 성장인자의 유전자 다형성과 그 혈중농도 및 골밀도사이의 상관성 김정구 , 서울대학교 , 2002 |
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피복입자 핵연료 기술개발 김정구 , 한국원자력연구원 , 2009 |
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차세대 네트워크 백본망 구축방안에 관한 연구 이경렬 , 한국전산원 , 2002 |
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진공 증착법과 노광/에칭공정을 제거한 5um선폭구현이 가능한 SemiAdditive법 연성회로기판 제작기술개발 이경렬 , 전자부품연구원 , 2013 |
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지문인식 기반의 휴대폰 온/오프라인 제어시스템 개발 유용석 , (주)니트젠 , 2005 |
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정보통신망 신뢰성 및 안전성 확보방안연구 - 자율규제 중심으로 - 김명아 , 한국인터넷진흥원(KISA) , 2009 |
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저분자량 올레핀 중합체로 이루어진 접착제 조성물 김학주 , 한국인터넷진흥원(KISA) , 2016 |
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저가격의 친환경 고차단성 포장재의 개발 김학주 , (주)주윈피엔비 , 2012 |
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이소시아네이트 제조용 고효율 촉매열분해공정 개발 김태우 , 한양대학교 , 2014 |
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이동 및 휴대 방송을 위한 DVB기반의 IP Datacasting(IPDC)단말 기술 개발 이재호 , (주)아이셋 , 2005 |